HardwareSecrets post some detailed infomation about the crazy Foxconn F1 prototype mobo. The data and pics are all taken from CES 2008.

The mobo is based on a new Intel Chipset, HS guesses maybe it is a P45. The copper thing you see on the board is not some ordinary cooling system, it is a water cooled system, and under the chipset waterblock it even have a thermoelectric cooler based on Peltier effect!(there is two wires go under the chipset waterblock. that should prove it.)

The full spec:

Foxconn F1 motherboard prototype main features are:

• Socket: 775.
• Chipset: Intel P45 (not confirmed)
• Super I/O: ITE IT8720F
• Parallel IDE: One ATA-133 port controlled by a JMicron JMB363 chip.
• Serial IDE: Six SATA-300 ports controlled by the south bridge chip and two eSATA ports controlled by a JMicron JMB363 chip.
• USB: 12 USB 2.0 ports (six soldered on the motherboard and six available thru I/O brackets).
• Firewire (IEEE 1394a): Two ports controlled by Texas Instruments TSB43AB22A chip, one soldered on the motherboard and one available thru an I/O bracket.
• On-board audio: No.
• On-board video: No.
• On-board LAN: Two Gigabit Ethernet ports, one controlled by the chipset together with a Broadcom chips to make the physical layer interface and the other controlled by a Broadcom BCM5788 chip (connected to the PCI bus).
• Buzzer: Yes.
• Power supply: EPS12V.
• Slots: Four PCI Express x16 slots, Four PCI Express x1 slots and two PCI slots, supporting CrossFire and CrossFireX.
• Memory: Four DDR-DIMM sockets.
• Extra features: Aluminum solid capacitors, ferrite coils, POST diagnostics display, water-cooling system (which cools down the north bridge chip, the south bridge chip and the voltage regulator transistors), thermoelectric cooler (“Peltier”) on the north bridge chip and on-board switches for power, reset and clear CMOS.