Western Digital to Deliver 2TB Caviar Black HDD Soon |

Western Digital is gearing up to deliver another model with 2TB capacity, Caviar Black series hard drive, according to AKIBA.
Western Digital to Deliver 2TB Caviar Black HDD Soon |

Western Digital is gearing up to deliver another model with 2TB capacity, Caviar Black series hard drive, according to AKIBA.
AMD Phenom II Black Edition TWKR Test Screenshot Leaked |

If you’re ever interested in AMD’s mysterious Phenom II Black Edition TWKR which we introduced here, you would be more than happy to read the following content.
AsRock Offers a More Affordable X58 Motherboard |

AsRock has now expanded its X58 motherboard lineup with X58 Extreme, oriented to budget users.
Gigabyte Tries out an Energy-efficient GeForce 9600GT |

Gigabyte has come up with an energy-efficient GeForce 9600GT graphics card, GV-N96TGR-512I, which is powered by 40% more power-efficient NVIDIA GeForce 9600GT GPU.
Seagate Debuts World’s First 640GB Portable Hard Drive |

Seagate has lately revealed the FreeAgent Go drive which offers up to 640GB of storage capacity and includes easy-to-use software that lets you automatically back up your data, synchronize files, and encrypt important files and folders. Plus, it’s the world’s first portable hard drive with a convenient desktop dock accessory.
LeadTek’s Single-PCB GTX 295 in Pretty Pixels |

Leadtek has recently unveiled the single-PCB GeForce GTX 295, and the folks at Donanimhaber has managed to posted some pretty pictures of it.
Prolimatech Megahalems Beats Ultra 120 Extreme |
Introduction
When we’re told the DFI LanParty CPU cooler actually came from Prolimatech, we started to notice this new company. Actually, the cooling solution provider has unveiled several large-size coolers, but Megahelems has been the most-watched one than any others.

Seagate’s Hard Drives Featuring SAS 2.0 Interface Hit Retail |
Microsoft Confirms Zune HD is Powered by NVIDIA Tegra Chip |

There has been a lot of news circulating about the rumor of the new Zune HD using the NVIDIA Tegra chip, and Microsoft has recently confirmed about this.
First Calpella Models Coming in Q3 Without Braidwood Technology |
Intel has recently told the notebook partners that the original models of Calpella platform powered by P55 chipset will not support the Braidwood technology, which means they will have to rely on discrete graphics.
P55 chipset and Clarksdale quad-core processor are set to launch in Q3 this year. The Braidwood support will be likely to come with P57 chipset in Q1 2010, according to Fudzilla.
Zalman Unveils FET Heatsink for HD 4890/4870 |
Zalman has unveiled the FET heatsink for AMD’s latest VGA card Radeon HD 4890 and HD 4870.
The ZM-RHS90 is made of pure aluminum for lightness, and offers high-performance cooling. You may install the heatsink by pushpins, which is apparently much easier. The availability or pricing is unknown yet, but it should show its face soon.
Toshiba, NEC and IBM Team up for 28nm Process Development |
Toshiba, NEC and IBM have joined force to develop the 28nm high-k metal gate low-power chip technology. The power-efficient chips will be used for future mobile devices and consumer electronics according to tcmagazine.
“The advanced 28nm low-power process technology will dramatically enhance the products’ density, performance, as well as power consumption compared to the former 40nm node, providing highly competitive solutions, especially in the fields of consumer electronics and automotive.” said Masao Fukuma, senior vice president of NEC Electronics.
ECS Works on Fastest GTS 250 Available |

The website Donanimhaber has recently unveiled ECS’ soon to be released GeForce GTS 250 which claims to be the fastest GTS 250 card.
OCZ’s Mainstream Agility SSDs on Sale Now |

Earlier this month OCZ announced the Agility Series 2.5″ SSDs for mainstream users, and the new stuff can be now found at Japanese store.
TSMC to Deliver Full-Node 28nm in Early 2010 |

Jack Sun, vide president R&D at TSMC
Jack Sun, Vice President R&D at TSMC, said that the company has accomplished the development of 28nm low-power technology at a symposium held in Japan, and the company plans to deliver it in early 2010 as a full node, offering the option of power-efficient high performance and lower power technologies.