In 2000, Cooler Master introduces the world’s first CPU cooler, while now the company bring industry’s first retail CPU hestsink which boasts Vertical Vapor Chamber technology.

Actually, the corresponding product of Vertical Vapor Chamber is our commonly-said vapor chamber. Vertical Vapor Chambers feature less than half the air resistance by reducing airflow vortexes and noise generated by air streaming through a heatsink. In addition, they exhibit 3 times the fin contact area, enabling faster and more efficient transfer of heat from the vapor chambers to the fins, and overall more efficient use of the available fin surface area.

According to Cooler Master, Vertical Vapor Chamber technology could provide heat dissipation power of over 200W, and it keeps the cooler’s noise in a lower level. In CES 2012 the company showcases TPC 812 cooler, which become the first consumer-level CPU tower heatsink which adopts vapor chamber. The launch time and price will be declared during CeBIT 2012.