iPhone 7 Teardown: InFO Packaged A10 Fusion Processor and Intel Baseband Inside

The iPhone 7 has aroused a great deal of public attention, especially when it started to hit retail yesterday. Some websites have actually grabbed one of them and given out teardown reports.

Chipworks has just torn down an iPhone 7 model A1778, and confirmed that the packed A10 Fusion processor is solely from TSMC. With a part number of APL1W24, 339S00255, the A10 has a die size of about 125mm² with 3.3 billion of transistors. Built on TSMC 16nm FinFET process, the processor is quite thin, assumably using TSMC’s InFO packaging technique.

Compared with CSP and PoP packaging, InFO (Integrated Fan Out) technique significantly reduces the total height of PoP, cuts the manufacturing cost and provides superior thermal performance.

Additionally, it’s been confirmed that the iPhone 7 A1778 is using Intel’s Baseband Processor PMB9943. It’s worth mentioning that the torn-down model is non-CDMA version, and the original site said they’d dig further on the iPhone CDMA A1660 to find out if things are different.

The Intel XMM7360 Modem is capable of LTE download speeds of up to 450Mbps, thanks to its compatibility with LTE Category 9 and 10.

Shall not be reproduced without permission:EXPREVIEW » iPhone 7 Teardown: InFO Packaged A10 Fusion Processor and Intel Baseband Inside

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