SK Hynix Probably be the First to Mass Produce 72-Layer 3D NAND Chips

Last week SK Hynix revealed its ambitious plan of investing 2.2 trillion won to build a plant in Cheongju, and the latest reports indicate that the South Korean chipmaker is making great progress on its development of 3D NAND flash chips. 

SK Hynix is expected to mass produce the advanced NAND chips with 72 layers of data-storing memory cells in the second half of next year, according to the source. The design should be completed during the first half of the year.

If things go smoothly, SK Hynix will become the world’s first chipmaker to start mass production of the 72-layer NAND chips.

Samsung, the pioneer of 3D NAND chips development, is scheduled to kick off mass production of its 64-layer NAND chips at the end of this year. Toshiba/Western Digital is also working on their 64-layer NAND chips, while the accurate time schedule is unknown yet.

Shall not be reproduced without permission:EXPREVIEW » SK Hynix Probably be the First to Mass Produce 72-Layer 3D NAND Chips

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